Microchip Technology has announced the SAM9X75D5M, an automotive-qualified system-in-package (SiP) hybrid microcontroller (MCU) combining an Arm926EJ-S processor with 512 Mbit DDR2 SDRAM in a single package. The device is AEC-Q100 Grade 2 qualified and targets automotive human-machine interface (HMI) applications including digital cockpit clusters, HVAC controls, and electric vehicle (EV) chargers, supporting display sizes up to 10 inches at XGA resolution.
By integrating the processor and memory into a single package, the SAM9X75D5M reduces printed circuit board routing complexity and removes reliance on discrete DDR memory procurement, which Microchip says has historically been subject to supply volatility. The device supports multiple display interfaces including MIPI Display Serial Interface, Low Voltage Differential Signalling, and parallel RGB, alongside connectivity options covering CAN FD, USB, and Gigabit Ethernet with Time-Sensitive Networking (TSN) protocol support.
The SiP is positioned as a migration path for designers moving from traditional microcontrollers to microprocessors (MPUs) to meet higher performance and memory demands, while retaining a familiar MCU development environment. It is available now at US$9.12 per unit in quantities of 5,000.
“One of the advantages of a SiP is that it provides significantly more RAM buffer space than a traditional MCU implementation and on a much more compact PCB than can be done with discrete memory,” said Rod Drake, Corporate Vice President of Microchip Technology’s MPU business unit.
Source: Microchip
